MIRTEC

Alfa Test is the regional partner for Mirtec in Romania, Bulgaria, Serbia, Croatia, North Macedonia and Bosnia for AOI and SPI inspection systems.

Mirtec is a South Korean company having an unrivaled technology in 3D and 2D vision optical inspection to develop the productivity in SMT, semiconductor, and LED manufacturing’s. The company has supplied its high-performance inspection devices to the cutting edge IT industries and automobile electrical fields, both of which require a great reliability and precision.

MV-3

MV-3 OMNI / MV-3L is a Full-3D / 2D off-line vision inspector with 15 / 10 Megapixel high resolution camera, Digital Moiré 8 Projection, 18 Megapixel side cameras and 8 phase coaxial color lighting system to allow inspection up to 03015(mm) chip.

  • Great inspection performance
    • Inspection for diffuse reflection component, OCR, micro crack precisely by 8 phases coaxial color lighting
    • Lifted BGA package and CSP package inspection by laser unit.
  • Simple and easy auto programming using IPC international standard library.
  • Off-line 2D AOI system meets outstanding performance, economy and space utilization.
Details
MV-6

MV-6e OMNI /MV-6em OMNI Series is a Full-3D inline vision inspector with 25 Megapixel high resolution camera, Digital moiré 8 projections, 18 Megapixel side cameras and 8 Phase coaxial color lighting system to allow inspection up to 03015 (mm) chip.

MV-6em OMNI is a 900mm slim size designed 3D AOI to provide excellent technology as well as space management to give more user convenience.

  • The world’s best performance 3D AOI
    • Inspection for diffuse reflection component, OCR, micro crack precisely by 8 phases coaxial color lighting
    • Smallest component inspection by ultra-high-resolution camera and lens
    • Non-blind spot digital 8 projection moiré 3D inspection technology
  • Hybrid Inspection: Best yield with combination of full 3D inspection, full 2D inspection and deep learning algorithm
  • One-Click Programming: simple and easy programming by using IPC international standard library.
  • Intellisys®: Total process management system for improving productivity and achieving smart factory.
Details
MV-9

MV-9 Series is a premium full 3D inline vision inspector with 25 Megapixel high resolution camera, Digital Moiré 8 projection, 18 Megapixel side cameras and 8 phase coaxial color lighting system to have capability to inspect up to 03015 (mm) chip.

  • World best super precision full 3D AOI
    • Inspection for diffused reflection component, OCR, micro crack precisely by 8 phases coaxial color lighting
    • Smallest component inspection by 25Megapixel 7.7 µm CXP main camera
    • Non-blind spot digital 8 projection moiré 3D inspection technology
  • Powerful 3D AOI which can be applied to SMT production line and second process of semiconductor manufacturing.
  • One-Click Programming: simple and easy programming by using IPC international standard library.
  • Hybrid Inspection: Best yield with combination of full 3D inspection, full 2D inspection and deep learning algorithm
Details
MS-11e

MS-11e/MS-11em Series is an inline 3D SPI machine which inspects the solder amount status after the solder is spread to clearly grasp the process. With a 25 Megapixel camera contributing to productivity enhancements, 0201 (mm) size solder paste inspection is possible.

MS-11em is a SPI with 900mm slim size design for better user convenience by having high technology as well as space utilization.

  • Outstanding performance
    • Super high resolution CXP camera and precision 6 µm lens
    • Solder paste inspection up to 0201(mm) size component pad
    • Shadow-free dual projection 3D measurement
  • Auto PCB warpage compensation
  • Closed-Loop System: Optimize the manufacturing process by connection with Screen Printer and Pick & Place Machine
  • Standard 3D AOI for various manufacturing process
Details
MS-15

MS-15 Series is a premium inline 3D SPI machine which inspects the solder amount status after the solder spread to clearly grasp the process and with 25 Megapixel camera contributing to productivity enhancements, 0201 (mm) size solder paste inspection is possible.

  • The world’s best performance 3D SPI
    • Super high resolution CXP camera and precision 6µm lens
    • Solder paste inspection up to 0201(mm) size component pad
    • Shadow-free dual projection 3D measurement
    • High accuracy and repeatability with linear motor drive system
  • Auto PCB warpage compensation
  • Closed-Loop System: Optimize the manufacturing process by connection with Screen Printer and Pick & Place Machine
  • High precision 3D SPI that can be applied to solder paste inspection of semiconductor second process, mini-LED and micro-LED.
Details

Rent equipment

Renting test and automation equipment is an alternative most don’t consider when they have an immediate or short-term requirement for a certain test or automation application. Short term, immediate requirements for test equipment come up often; instances of equipment failure, project overload, unique testing and many other circumstances make renting test and automation equipment a desired service.