MAGIC RAY

3D AOI – Cube Series boasts cutting-edge positioning technology and advanced feature analysis algorithms, making it ideal for high-speed, high-precision inspections of SMT components in SMT pre-reflow and post-reflow processes. The Cube Series eliminates shadow blind spots and accurately captures 3D component shapes for optimal results with its state-of-the-art multi-fringe projection technique.

Product Features:

• Rich algorithm – The combination of 3D, AI, and color feature algorithms optimizes the defect detection rate.
• Multiple positioning methods – Precisely locates components, compensates for board warpage, and detects defects on black components on black boards.
• Adaptive detection – Detects both black and white PCBs effectively.
• High-speed inspection – Marble platform, dual-drive, and motion control card ensure industry-leading inspection speeds.
• Ultra-high range 3D reconstruction – Measures components up to 35mm in height.
• Advanced defect analysis – Three-point check software and SPC data analysis quickly identify the root cause of defects.

Magic-ray inline AOI-V5000 series are suitable for high-precision and high-speed inline inspection of both pre-reflow and post-reflow.

Product Features:

• Use of granite platform and telecentric lens.
• Advanced software algorithms ensure highly reliable inspection results.
• Automatic compensation for board warpage or PCB deformed by high temperature effects makes our machine just as suitable for FPC.
• SPC data analysis helps to improve process quality.

The Magic-ray Double-Sided AOI-V5300 series delivers an advanced, fully automated final inspection system designed for simultaneous top and bottom PCBA inspection. This high-precision AOI solution enhances production efficiency by reducing errors and ensuring optimal quality control. It provides a seamless, space-saving inspection process for PCB assemblies and finished electronic products

Product Features:

• Capable of inspecting both sides of the PCBA simultaneously, maximizing production efficiency while minimizing space usage and cost.
• Pulley-type conveyor option available, offering enhanced resistance to high temperatures, dust, and heavy loads compared to standard belt conveyors.
• Magic-ray’s proprietary Solder Pad Positioning Algorithm and FOV-Assisted Positioning ensure highly accurate component detection.
• CPU-specific algorithm for pin inspection accurately identifies defects, including pin bending, deformation, and missing pins.

Magic-ray 3D SPI – Icon series are designed for precise 3D solder paste inspection following SMT screen printing, ensuring high-quality results.

Product Features:

• High accuracy: Intelligent zero reference point technology ensures accurate measurement, especially for PCB board deformation.
• High performance: Perfect combination of 3D and color-featured algorithm ensures effective detection on solder bridging, solder breakage, icicle, etc
• High speed: Flexible choices of multiple optical options, with industry-leading inspection speed and performance.
• Strong Anti-jamming. Effectively detects PCB color variations and automatically adjusts inspection parameters for black and white boards.
• Fast programming can be achieved with/without Gerber.
• Process optimization: SPC data analysis helps to improve process quality.

Magic-ray Conformal Coating AOI are suitable for inline single: VC5000/VC5100, / double-sided: VC5300, automatic inspection of conformal coating.

Product Features:

• Usage of high-brightness UV lighting, easily distinguishes the coating containing phosphor.
• Support intelligent programming of detection areas across FOV and of components across CAD, adaptive to multiple inspection scenarios.
• Support Single-side or Double-side inline automatic inspection of conformal coating.
• Coating Thickness Measurement is optional, realizing real-time high-precision thickness measurement.
• Optional intelligent AI algorithm optimizes detection on bubble defects.

Magic-Ray’s Underfill Adhesive AOI VF5100 (Single-side), VF5300 (Double-sided)—Suitable for the proportion inspection of climbing height of Underfill adhesive (UF adhesive) on the side of the component. They are compatible with different types of adhesive detection: UV adhesive, RTV adhesive, heat dissipation adhesive, etc., as well as normal component inspection.

Product Features:

• Five-sided inspection, with full coverage around the components.
• Automatically draw side adhesive contour lines to clearly distinguish adhesive boundaries.
• Slide mouse to view the percentage of climbing height at any position of the side of the component
• Save images of five sides and test data to facilitate process review.
• Optional thickness measurement function to achieve inline measurement of adhesive thickness.

Magic-Ray’s inline 3D AXI is suitable for inline non-destructive inspection of SMT, DIP, and IGBT semiconductors. Covering BGA/LGA/CSP, SOP/QFP/QFN, Transistors, R/C-IGBT, Bottom Electrodes, Power Modules, POP, Connectors, THT Components, and more.

Product Features:

• Features high-speed dynamic imaging, detection speed reaches 1.7 seconds/FOV.
• Adaptively applies 7 projection styles and 7 resolution types to satisfy various usage scenarios.
• Supports 3 separate programming styles, one-touch value learning functionality, and more.
• The XY, YZ, XZ three-view interface makes diagnosing defects more intuitive.
• Dual linear motors with grating rulers ensure precise positioning.

Magic-Ray Mounting AOI—SD5000 series, are suitable for complex substrate inspection before bonding to ensure the bonding yield. Semiconductor Mounting AOI /Chip & Substrate Scratch Inspection Expert.

Product Features:

• Marble platform and high-resolution telecentric lens are applied to ensure high precision.
• 6-channel multi-angle programmable lighting, can be flexibly matched to amplify defect features.
• Intelligent recognition of gold fingers and substrate areas to enable inspection of any position on the substrate.
• Powerful algorithms allow for strong gold finger scratch and yellowing inspection capabilities.
• Multi-layer positioning algorithm can cope with board bending deformation, with vacuum adsorption option available.
• Can be collocated with loader and unloader for offline inspection.

Magic-Ray wire bonding AOI — SW6000 utilizes 3D structured light for the third-order optical inspection of semiconductors and lead wires (2mil and up). Features rapid post wire bonding defect testing and precision inspection, as well as advanced functionalities for rapid programming, defect annotation, and data storage.

Product Features:

• Designed for power component packaging post-die and wire bonding defect detection.
• Combined 2D camera & 3D structured light image capture for rapid inspection.
• Compatible with conveyor track to allow for inline testing and features offline testing with automatic loading and unloading.
• AI-powered smart programming vastly improves programming efficiency.
• Completely offline programming capabilities – debugging without stopping production.
• Flexible lighting and adjustable Z-axis easily handle complicated inspection situations.
• Links with MES systems, supports TCP/IP, SECS/GEM communication protocols, and more.
• Advanced SPC capabilities support data review and process analysis.